Heat Transfer & Cooling Heat transfer & cooling

Effective Overmoulding of Electronics

3M™ Case Study in cooperation with Raschig GmbH.

Thermoset injection moulding of electronic components combines mechanical protection with effective thermal management.

Whenever electronic components are to be encapsulated in a media-tight and gentle manner, and thermal management is required, Direct Injection Moulding (DIM) – the direct overmoulding of the component – is a target-oriented solution. By using epoxy moulding compounds and specifically selected fillers such as boron nitride, it’s possible to protect components in harsh environmental conditions.

Download the case study to see how companies in the special plastics segment use 3M Boron Nitride Cooling Fillers to create different  compositions of fillers to meet specific requirements.